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Heat sinks - extrusions, boardlevel, copper, aluminum

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Products / Heat Pipe Assemblies
Ball Grid Arrays (BGAs)
Aavid Thermalloy offers the broadest line of innovative BGA heatsinks to support the most demanding applications. Choose from a variety of attachment methods to meet your needs. 		BGA heat sinks

Solder Anchor Attachment

BGA heat sinks Rugged mounting method used with a phase change pad for excellent thermal performance. Requires anchors to be soldered to the circuit card. Available for standard BGA and flip chip packages.

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»Browse Flip Chip Package Heat Sinks
BGA heat sinks

»View anchor drawing

Push Pin Attachment

BGA heat sinks This one piece design makes assembly a snap. Pins latch into holes in the circuit card and offer enhanced reliability where vibration is a concern. Coil springs maintain even pressure across the phase change interface.

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Tape Attachment

BGA heat sinks Thermally conductive adhesive tape provides easy and reliable mounting. The adhesive is specially formulated to provide exceptional bonding properties for plastic or metal/ceramic packages.

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»Browse Heat Sinks for Plastic Packages


BGS Clip Attachment

BGA heat sinks Provides mechanical attachment without added holes in the PCB. End plates firmly engage the device while springs apply mounting pressure. Pre-applied thermal grease provides optimum thermal performance.

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Epoxy Attachment

BGA heat sinks Available in both bi-directional and pin fin configurations. Epoxy provides a strong bond without extra board space required.

»Browse Bi-Directional Heat Sinks

»Browse Pin Fin Heat Sinks

Fan Heatsinks

BGA heat sinks High performance fans provide impingement airflow to cool the most demanding applications. Available with 5 or 12 volt fans and push pin or epoxy attachment .

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Thin Fin Heatsinks

BGA heat sinks Low profile copper heatsinks ideal for PCI or AGP chipsets.

»View Datasheet

Radial Fin Heatsinks

BGA heat sinks Bond-on heatsinks for leadless chip carriers and flatpacks. Primarily designed for 68 position devices.

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